NDLI: Effect of temperature cycling on angular alignment in add/drop filter-module packaging

Content Provider	Springer Nature Link
Author	Hsieh, C. S. Chen, J. M. Hsu, J. M. Sheen, M. T. Kuang, J. H. Cheng, W. H.
Copyright Year	2003
Abstract	The thermally-induced, fiber-alignment shifts of ferrule-solder-ferrule (FSF) joints in add/drop filter-module packaging for multiplexer/demultiplexer applications have been studied experimentally and numerically. From experimental measurements of the module-insertion loss difference (0.3 dB) with and without temperature cycling, FSF angular-tilt misalignments of up to 0.05° were found after undergoing 42 temperature cycles. The effects of an imperfect soldering process along the two ferrules during the packaging of an add/drop filter module on the angular-tilt misalignment has been explored in this study. An elastic-plastic finite-element method (FEM) was performed to evaluate the variation of thermal stresses, the distribution of residual stresses, and the angular-tilt misalignment of the FSF joints. Experimental measurements of the FSF angular-tilt misalignment were in good agreement with the FEM calculations. The major angular-tilt misalignments of FSF joints in add/drop filter-module packaging during temperature cycling may come from the localized plastic-solder yielding introduced by the local thermal-stress variation and the redistribution of the residual stresses within the solder. The FSF angular-tilt misalignment and, hence, fiber-alignment shift of the add/drop filter module under temperature-cycling tests can be reduced significantly if a perfect soldering process along the two ferrules can be fabricated.
Starting Page	137
Ending Page	141
Page Count	5
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	32
Issue Number	3
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2003-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Fiber-alignment shift add/drop filter-module packaging finite-element method Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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