NDLI: Fracture toughness of Cu-Sn intermetallic thin films

Content Provider	Springer Nature Link
Author	Balakrisnan, B. Chum, C. C. Li, M. Chen, Z. Cahyadi, T.
Copyright Year	2003
Abstract	Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength of the IMCs will facilitate predicting the overall joint property, as it is more disposed to failure at the joint compared to the solder because of its brittle characteristics. The salient feature of this paper is the measurement of the fracture toughness and the critical energy-release rate of Cu$_{3}$Sn and Cu$_{6}$Sn$_{5}$ intermetallic thin films, which is the result of the interaction between Sn from the solder and Cu from the metallization. To achieve the objective, a controlled buckling test was used. A buckling test in the current work refers to one that displays large transverse displacement caused by axial compressive loading on a slender beam. The stress and strain along the beam can be easily calculated by the applied displacement. Fracture-toughness values of Cu$_{3}$Sn and Cu$_{6}$Sn$_{5}$ are 2.85 MPa √m ± 0.17 MPa √m and 2.36 MPa √m ± 0.15 MPa √m, respectively. Corresponding critical energy-release rate values are 65.5 J/m$^{2}$ ± 8.0 J/m$^{2}$ and 55.9 J/m$^{2}$ ± 7.3 J/m$^{2}$, respectively. The values obtained were much higher than the ones measured in bulk intermetallic samples but correlated well with those values obtained from conventional fracture-toughness specimens when fracture was confined within the intermetallic layers. Hence, the controlled buckling test is a promising fast and effective way to elucidate mechanical properties of thin films.
Starting Page	166
Ending Page	171
Page Count	6
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	32
Issue Number	3
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2003-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Fracture toughness critical energy-release rate thin intermetallic films Cu$_{3}$Sn Cu$_{6}$Sn$_{5}$ controlled buckling test Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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