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| Content Provider | Springer Nature Link |
|---|---|
| Author | Chan, S.K. Lok, S.K. Wang, G. Cai, Y. Wang, N. Sou, I.K. |
| Copyright Year | 2008 |
| Abstract | Nanotrenches are induced by thermal annealing Au droplets on ZnSe surfaces. High-resolution scanning electron microscopy studies of the nanotrench structures reveal that the preferred migration directions of the catalyst droplets are along the $$ {\left\langle {{\hbox{110}}} \right\rangle } $$ direction family. On a ZnSe(111)B surface, each of the trenches is along one of the six $$ {\left\langle {{\hbox{110}}} \right\rangle } $$ directions while on a nonvicinal ZnSe(100) surface, the trenches are along a pair of antiparallel $$ {\left\langle {{\hbox{110}}} \right\rangle } $$ directions. Based on the results obtained from atomic force microscopy surface profiling and electron energy-loss spectroscopy chemical analysis techniques, a model is proposed to describe the possible formation mechanisms of the␣observed nanotrenches. The highly parallel nanotrenches induced on the Au/ZnSe(100) structure as revealed in this study are potentially useful as a template for in situ fabrication of ordered one-dimensional nanostructures (such as nanowires) of many materials. |
| Starting Page | 1344 |
| Ending Page | 1348 |
| Page Count | 5 |
| File Format | |
| ISSN | 03615235 |
| Journal | Journal of Electronic Materials |
| Volume Number | 37 |
| Issue Number | 9 |
| e-ISSN | 1543186X |
| Language | English |
| Publisher | Springer US |
| Publisher Date | 2008-03-28 |
| Publisher Place | Boston |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Nanotrenches migration of catalyst particles molecular beam epitaxy ZnSe Au Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials |
| Content Type | Text |
| Resource Type | Article |
| Subject | Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering |
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