NDLI: Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

Content Provider	Springer Nature Link
Author	Cheng, L. X. Li, G. Y. Li, Z. L. Wu, Z. Z. Zhou, B.
Copyright Year	2015
Abstract	The role of active element titanium for the bonding alumina substrates using Sn3.5Ag4Ti(Ce,Ga) alloy filler at 250 °C in air was studied. The influence of soldering time on the microstructure and element distribution was investigated. It was observed that the Sn3.5Ag4Ti(Ce,Ga) solder could wet the alumina well under the agitation of external force. No continuous reaction products could be detected at the alumina/solder interface by using scanning electron microscopy and X-ray diffractometer. It might be inferred that the joining could be accomplished by chemical adsorption of Ti on the alumina/solder interface, regardless of whether or not an interfacial reaction layer is formed. The theoretical analysis of the Ti element adsorption at the alumina/solder interface was tried. Results can further explain the adsorption phenomenon of Ti at the interface prior to bond formation. In the case of environmental temperature has yet to meet the chemical reaction conditions, the chemical adsorption between active elements and alumina can get good bond as well. The shear strengths of the soldered Al$_{2}$O$_{3}$/Al$_{2}$O$_{3}$ substrates with the soldering time of 15 min, 30 min, and 1 h were measured to be 15.46, 16.15, and 17.39 MPa respectively.
Starting Page	6004
Ending Page	6012
Page Count	9
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	26
Issue Number	8
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2015-05-12
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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