NDLI: Real time surface morphology analysis of semiconductor materials and devices using 4D interference microscopy

Content Provider	Springer Nature Link
Author	Montgomery, Paul Anstotz, Freddy Johnson, Gyasi Kiefer, Renaud
Copyright Year	2007
Abstract	Recently, 4D microscopy (3D + t) has been demonstrated in confocal, near field, digital holographic and scanning interference microscopy. The last technique is of particular interest to semiconductor materials and device analysis because of its nanometric axial resolution over a large depth of field. In our first prototype system based on scanning white light interferometry we recently demonstrated real time 3D measurement of non-periodic movement at a rate of 5 i/s over 2 μm using a high speed CCD camera (250 i/s) and FPGA based image processing. In the present work we report on a second prototype based on a higher performance CMOS camera having a frame rate of 500 i/s at full frame and up to 16,000 i/s at reduced frame size. Results are shown of a 3D measurement rate of 18 i/s over a depth of 8 μm using post-processing. Different algorithms are being modeled in VHDL for performing the processing on a more complex FPGA based board in real time. It is reasonable to expect 3D image rates of tens and hundreds of images per second depending on the frame size and scanning depth. This will open the way for performing new types of high speed surface morphology characterization in semiconductor materials and device development.
Starting Page	194
Ending Page	198
Page Count	5
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	19
Issue Number	1
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2007-12-05
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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