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  1. Journal of Materials Science: Materials in Electronics
  2. Journal of Materials Science: Materials in Electronics : Volume 14
  3. Journal of Materials Science: Materials in Electronics : Volume 14, Issue 5-7, May 2003
  4. A batch process to deposit amorphous metallic Mo–Si–N films
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Journal of Materials Science: Materials in Electronics : Volume 28
Journal of Materials Science: Materials in Electronics : Volume 27
Journal of Materials Science: Materials in Electronics : Volume 26
Journal of Materials Science: Materials in Electronics : Volume 25
Journal of Materials Science: Materials in Electronics : Volume 24
Journal of Materials Science: Materials in Electronics : Volume 23
Journal of Materials Science: Materials in Electronics : Volume 22
Journal of Materials Science: Materials in Electronics : Volume 21
Journal of Materials Science: Materials in Electronics : Volume 20
Journal of Materials Science: Materials in Electronics : Volume 19
Journal of Materials Science: Materials in Electronics : Volume 18
Journal of Materials Science: Materials in Electronics : Volume 17
Journal of Materials Science: Materials in Electronics : Volume 16
Journal of Materials Science: Materials in Electronics : Volume 15
Journal of Materials Science: Materials in Electronics : Volume 14
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 10-12, October 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 9, September 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 8, August 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 5-7, May 2003
Editorial ( Journal of Materials Science: Materials in Electronics , Volume 14 , Issue 5-7 )
Confined epitaxial growth by low-pressure chemical vapor deposition
Non-selective growth of SiGe heterojunction bipolar trasistor layers at 700 °C with dual control of n- and p-type dopant profiles
Misfit dislocations in GaAsN/GaAs interface
AlGaN/GaN HEMTS: material, processing, and characterization
High-temperature strength of bulk single crystals of III-V nitrides
Tilted-wing-induced stress distribution in epitaxial lateral overgrown GaN
Electrical characterization of MIS capacitors fabricated from ECR-PECVD silicon oxide and silicon nitride bilayer films
Structural and optical characterization of CuInS$_{2}$ thin films grown by vacuum evaporation method
Effect of high hydrostatic pressure during annealing on silicon implanted with oxygen
Transfer of thin Si layers by cold and thermal ion cutting
Transformation of hydrogen trapped onto microbubbles into H platelet layer in SI
Capacitance and current–voltage simulation of EEPROM technology highly doped MOS structures
Rapid thermal annealing of Cu/WN$_{ x }$/Si structures
Realization of electroplating molds with thick positive SPR 220-7 photoresist
Self-assembled germanium islands grown on (0 0 1) silicon substrates by low-pressure chemical vapor deposition
Low-temperature plasma-enhanced chemical vapor deposition of tungsten and tungsten nitride
Copper nanoparticles within amorphous and crystalline dielectric matrices
Growth and magnetic properties of MnGe films for spintronic application
Infrared absorption of a-SiC : H as a function of the annealing temperature
Spectroellipsometric studies of 0.9PbMg$_{1/3}$Nb$_{2/3}$O$_{3}$-0.1PbTiO$_{3}$ thin films
In(Ga)As quantum dots on Ge substrate
Formation kinetics and structure of self-assembled poly(3-alkylthiophene) films on gold surface
Photoluminescence study of strain-induced GaInNAs/GaAs quantum dots
Atomic layer deposition of HfO$_{2}$ thin films and nanolayered HfO$_{2}$–Al$_{2}$O$_{3}$–Nb$_{2}$O$_{5}$ dielectrics
Relaxor ferroelectric thin-film heterostructures: Scaling of dielectric properties
A comparative study of anodic tantalum pentoxide and high-pressure sputtered titanium oxide
Surface treatment for high-quality Al$_{2}$O$_{3}$ and HfO$_{2}$ layers deposited on HF-dipped surface by atomic layer deposition
Electrical and microstructural properties of Bi$_{2−x }$Sb$_{ x }$Te and Bi$_{2−x }$Sb$_{ x }$Te$_{2}$ foils obtained by the ultrarapid quenching process
Polyaniline films deposited by anodic polymerization: Properties and applications to chemical sensing
Planar chiral meta-materials for photonic devices
Effects of molecular shape on the photoluminescence of dyes embedded in a chiral polymer with a photonic band gap
Growth of GaAs on polycrystalline silicon-on-insulator
Low-temperature PECVD deposition of highly conductive microcrystalline silicon thin films
Photonic band gaps in 12-fold symmetric quasicrystals
Optical waveguides on polysilicon-on-insulator
Nonradiative electron–hole recombination in ZnSSe epitaxial layers examined by piezoelectric photothermal spectroscopy
A batch process to deposit amorphous metallic Mo–Si–N films
Piezoelectric ZnO films by r.f. sputtering
Radiation damage induced in Si photodiodes by high-temperature neutron irradiation
Micro-Raman investigations of the degree of relaxation in thin SiGe buffer layers with high Ge content
Correlating integrated circuit process-induced strain and defects against device yield and process control monitoring data
Influence of irradiation temperature on electron-irradiated STI Si diodes
Stress characterization of device layers and the underlying Si$_{1−x }$Ge$_{ x }$ virtual substrate with high-resolution micro-Raman spectroscopy
3D atomic imaging of SiGe system by X-ray fluorescence holography
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 4, April 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 3, March 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 2, February 2003
Journal of Materials Science: Materials in Electronics : Volume 14, Issue 1, January 2003
Journal of Materials Science: Materials in Electronics : Volume 13
Journal of Materials Science: Materials in Electronics : Volume 12
Journal of Materials Science: Materials in Electronics : Volume 11
Journal of Materials Science: Materials in Electronics : Volume 10
Journal of Materials Science: Materials in Electronics : Volume 9
Journal of Materials Science: Materials in Electronics : Volume 8

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A batch process to deposit amorphous metallic Mo–Si–N films

Content Provider Springer Nature Link
Author Kattelus, H. Heikkinen, H. Häärä, A. Ylönen, M. Tolkki, A.
Copyright Year 2003
Abstract A process for depositing amorphous electrically conducting Mo–Si–N films in a batch-type reactive sputtering system has been developed. Each elemental constituent in the film is individually adjustable: molybdenum and silicon through the electrical power applied to the separate targets, and nitrogen through the gas flow rate. Argon is used for the tuning of the intrinsic stress. The amorphous structure of a Mo$_{31}$Si$_{18}$N$_{45}$ film is confirmed by cross-sectional transmission electron microscopy and electron diffraction. The structure remains unchanged up to at least 700 °C for 1 min of annealing in an argon ambient. In the process, the room-temperature resistivity decreases from an initial value of about 1.1 to about 1.0 mΩ cm with no change in the film thickness. After 1100 °C for one minute, grains nucleate and the film resistivity falls by two-thirds. The intrinsic stress in Mo–Si–N films is significantly more uniform throughout the film area than in polycrystalline molybdenum films. These results hold promise for applications of Mo–Si–N films in micromechanical devices. Self-supported beams and membranes have been successfully delaminated from their silicon substrates; molybdenum-rich films are more ductile than silicon-rich films.
Starting Page 427
Ending Page 430
Page Count 4
File Format PDF
ISSN 09574522
Journal Journal of Materials Science: Materials in Electronics
Volume Number 14
Issue Number 5-7
e-ISSN 1573482X
Language English
Publisher Kluwer Academic Publishers
Publisher Date 2003-01-01
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Optical and Electronic Materials Characterization and Evaluation Materials
Content Type Text
Resource Type Article
Subject Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering
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