NDLI: Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

Content Provider	Springer Nature Link
Author	El Daly, A. A. Fawzy, A. Mansour, S. F. Younis, M. J.
Copyright Year	2013
Abstract	The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to investigate the influence of SiC nano-particles addition on the microstructure, thermal behavior, and corresponding mechanical properties of SAC(105) solder alloys. Results show that the addition of SiC nanoparticles into the SAC(105) alloy melt prompts the formation of primary β-Sn phase with small sub-grain size in the solidified structure. The SiC nanoparticles can offer an additional nucleation sites for the formation of refined Ag$_{3}$Sn and Cu$_{6}$Sn$_{5}$ IMCs. The hard SiC particles and refined IMCs with small spacing could obstruct the dislocation slipping and thus, lead to a strong dispersion strengthening mechanism in the composite solder. As a result, the composite SAC(105)/SiC solder displayed a higher ultimate tensile strength and 0.2 % yield strength (0.2 %YS) than that of plain SAC(105) solder. The addition of SiC nano-sized particles can also effectively reduce the undercooling and pasty range, while the melting temperature is maintained at the SAC(105) level, indicating that the novel composite solder is fit for existing soldering process.
Starting Page	2976
Ending Page	2988
Page Count	13
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	24
Issue Number	8
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2013-03-29
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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