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  1. Journal of Materials Science: Materials in Electronics
  2. Journal of Materials Science: Materials in Electronics : Volume 17
  3. Journal of Materials Science: Materials in Electronics : Volume 17, Issue 8, August 2006
  4. Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading
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Journal of Materials Science: Materials in Electronics : Volume 28
Journal of Materials Science: Materials in Electronics : Volume 27
Journal of Materials Science: Materials in Electronics : Volume 26
Journal of Materials Science: Materials in Electronics : Volume 25
Journal of Materials Science: Materials in Electronics : Volume 24
Journal of Materials Science: Materials in Electronics : Volume 23
Journal of Materials Science: Materials in Electronics : Volume 22
Journal of Materials Science: Materials in Electronics : Volume 21
Journal of Materials Science: Materials in Electronics : Volume 20
Journal of Materials Science: Materials in Electronics : Volume 19
Journal of Materials Science: Materials in Electronics : Volume 18
Journal of Materials Science: Materials in Electronics : Volume 17
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 12, December 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 11, November 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 10, October 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 9, September 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 8, August 2006
Electrical characterization of semiconductor materials and devices—review
Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading
Low dielectric loss and enhanced tunable properties of Cr-doped barium strontium titanate solid solution
Morphological analysis of poly(o-methoxyaniline) thin-films deposited by spin coating technique
Comparative performance of gold wire bonding on rigid and flexible substrates
The study of forming gas plasma on HSG-7000 silsesquioxane-based low-k dielectric film using X-ray photoelectron spectroscopy
Characterization of CuAlO$_{2}$ films prepared by dc reactive magnetron sputtering
Spin Glass transition on Fe$_{0.6}$Cr$_{0.1}$Al$_{0.3}$ and Fe$_{0.6}$Ti$_{0.1}$Al$_{0.3}$
Some physical properties of CuInSe$_{2}$ thin films
Ferroelectric polymeric PVDF films prepared by ultrasonic atomization method
Preparation and properties of low-temperature co-fired ceramic of CaO–SiO$_{2}$–B$_{2}$O$_{3}$ system
Ge/Si heterojunction photodetector for 1.064 µm laser pulses
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 7, July 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 6, June 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 5, May 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 4, April 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 3, March 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 2, February 2006
Journal of Materials Science: Materials in Electronics : Volume 17, Issue 1, January 2006
Journal of Materials Science: Materials in Electronics : Volume 16
Journal of Materials Science: Materials in Electronics : Volume 15
Journal of Materials Science: Materials in Electronics : Volume 14
Journal of Materials Science: Materials in Electronics : Volume 13
Journal of Materials Science: Materials in Electronics : Volume 12
Journal of Materials Science: Materials in Electronics : Volume 11
Journal of Materials Science: Materials in Electronics : Volume 10
Journal of Materials Science: Materials in Electronics : Volume 9
Journal of Materials Science: Materials in Electronics : Volume 8

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Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading

Content Provider Springer Nature Link
Author Lin, Chih Kuang Teng, Hsuan Yu
Copyright Year 2006
Abstract The purpose of this study is to investigate the creep behavior and develop a suitable life assessment model for a lead-free Sn-3.5Ag-0.5Cu solder subjected to variable-step creep loading. Creep tests were conducted under two-step loading with various combinations of stress and temperature. Experimental results showed existence of sequence effects on cumulative creep damage for the given ternary alloy under two-step loading or temperature. A high-low sequence is more damaging than a low-high sequence for all given two-step loading/temperature conditions. Furthermore, the creep rate in the second step of a high-low sequence was greater than that under single-step loading while no significant difference in creep rate was observed in the second step of a low-high sequence compared with the single-step loading one. A nonlinear cumulative creep damage model was proposed and made reasonably good predictions of creep lifetime for all the given two-step creep testing conditions. This model also predicts the sequence effects that a low-high step loading would produce a larger sum of lifetime fraction than a high-low one.
Starting Page 577
Ending Page 586
Page Count 10
File Format PDF
ISSN 09574522
Journal Journal of Materials Science: Materials in Electronics
Volume Number 17
Issue Number 8
e-ISSN 1573482X
Language English
Publisher Kluwer Academic Publishers
Publisher Date 2006-01-01
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Characterization and Evaluation Materials Optical and Electronic Materials
Content Type Text
Resource Type Article
Subject Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering
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