NDLI: Fluxless tin bonding of silicon chips to iron substrates

Content Provider	Springer Nature Link
Author	Hsu, Shou Jen Lee, Chin C.
Copyright Year	2013
Abstract	A fluxless process of bonding silicon (Si) chips to iron (Fe) substrates was successfully developed. Iron substrates are plated with Ni, followed by tin (Sn). Si chips are deposited with thin chromium (Cr) and gold (Au) using E-beam evaporation in high vacuum. The Si chip is placed over the Fe substrate and bonded at 240 °C. The resulting joint is very uniform and contains few voids as examined by scanning electron microscopy. The reactions between Fe/Ni and Sn and between Si/Cr/Au and Sn during the soldering process are studied. The Si/Cr-Sn interface is free from intermetallic compound (IMC), i.e., IMC-free. Three-dimensional Ni$_{3}$Sn$_{4}$ microstructure is revealed by etching Sn away from the samples. The Fe/Ni–Sn interface forms rod-shaped or polygonal-shaped Ni$_{3}$Sn$_{4}$ microstructure. This new fluxless bonding process should be valuable in expanding the use of iron to electronic packaging applications such as substrates, base plates, thermal blocks, and chip-attachable casings.
Starting Page	2890
Ending Page	2896
Page Count	7
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	24
Issue Number	8
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2013-03-19
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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