NDLI: Microstructure, elastic modulus and shear strength of alumina (Al$_{2}$O$_{3}$) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Content Provider	Springer Nature Link
Author	Gain, Asit Kumar Zhang, Liangchi Chan, Y. C.
Copyright Year	2015
Abstract	This paper investigates the influence of Al$_{2}$O$_{3}$ nanoparticles on the morphology of interfacial intermetallic compound (IMC) layer and material properties of Sn–3.0Ag–0.5Cu (wt%) solders on Cu and Au/Ni-plated Cu substrates. In the solder/Cu substrate systems, an island-shaped Cu$_{6}$Sn$_{5}$ IMC layer was found to be adhered at the interface in the initial reaction stage. However, a very thin Cu$_{3}$Sn IMC layer was also observed between the Cu$_{6}$Sn$_{5}$ IMC layer and Cu substrate after long time reaction in all solder joints. On the other hand, a ternary scallop-shaped (Cu, Ni)–Sn IMC layer was found in both plain Sn–Ag–Cu solder joints and solder joints containing Al$_{2}$O$_{3}$ nanoparticles on Au/Ni-plated Cu substrates. These IMC layer thicknesses were increased with the reaction time. In the solder ball region, Ag$_{3}$Sn, Cu$_{6}$Sn$_{5}$ IMCs were found to be uniformly distributed in the β-Sn matrix in both types of solder joints. However, after adding Al$_{2}$O$_{3}$ nanoparticles these IMCs appeared with fine microstructure. Furthermore, the elastic moduli and shear strength of composite solders containing Al$_{2}$O$_{3}$ nanoparticles exhibited consistently higher value than that of plain Sn–Ag–Cu solder joints by a second phase dispersion strengthening mechanism. The fracture surface of plain Sn–Ag–Cu solder joints appeared a brittle fracture mode with a smooth surface, while Sn–Ag–Cu solder joints containing Al$_{2}$O$_{3}$ nanoparticles showed semi-ductile failure characteristics with rough dimpled surfaces.
Starting Page	7039
Ending Page	7048
Page Count	10
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	26
Issue Number	9
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2015-06-13
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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