NDLI: Characters of multicomponent lead-free solders

Content Provider	Springer Nature Link
Author	Zhao, N. Liu, X. Y. Huang, M. L. Ma, H. T.
Copyright Year	2013
Abstract	In the process of electronic packaging, such as flip chip technology, under bump metallization (UBM) can be consumed gradually by solder during soldering. Then dissolution of Ni, Au and Cu from UBM into the solder may change the original solder to a multicomponent one especially under the trend of miniaturization. It is quite necessary to evaluate the properties of the multicomponent solders that have new composition after soldering. In this study, the microstructure, thermal and mechanical properties of five types of multicomponent lead-free solders, i.e. Sn–2Cu–0.5Ni, Sn–2Cu–0.5Ni–0.5Au, Sn–3.5Ag–0.5Ni, Sn–3.5Ag–1Cu–0.5Ni and Sn–3.5Ag–2Cu–0.5Ni (all in wt% unless specified otherwise) were investigated. Comparison with eutectic Sn–0.7Cu, Sn–3.5Ag and Sn–3.5Ag–0.7Cu solders was made. There was no obvious difference of the melting point between the multicomponent lead-free solders and the eutectic ones. For Sn–2Cu–0.5Ni solder, Cu$_{6}$Sn$_{5}$ and (Cu,Ni)$_{6}$Sn$_{5}$ intermetallic compounds (IMCs) formed. In the case of Sn–2Cu–0.5Ni–0.5Au, besides (Cu,Ni)$_{6}$Sn$_{5}$, (Cu,Au)$_{6}$Sn$_{5}$ and (Cu,Ni,Au)$_{6}$Sn$_{5}$ were also observed. The IMCs formed in Sn–3.5Ag–0.5Ni solder were Ag$_{3}$Sn and Ni$_{3}$Sn$_{4}$. In both Sn–3.5Ag–1Cu–0.5Ni and Sn–3.5Ag–2Cu–0.5Ni solders, Ag$_{3}$Sn and (Cu,Ni)$_{6}$Sn$_{5}$ were detected. The mechanism for the formation of the IMCs was discussed. Tensile test was also conducted. The fractography indicated that all of the multicomponent lead-free solders exhibited a ductile rupture.
Starting Page	3925
Ending Page	3931
Page Count	7
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	24
Issue Number	10
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2013-06-19
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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