NDLI: Development of a lead-free composite solder from Sn–Ag

Content Provider	Springer Nature Link
Author	Chantaramanee, S. Wisutmethangoon, S. Sikong, L. Plookphol, T.
Copyright Year	2013
Abstract	The microelectronic applications of lead-free solders pose ever-increasing demands. We seek to improve the solder by forming composites with Ag-coated single-walled carbon nanotubes (Ag-coated SWCNTs). These were incorporated into 96.5Sn–3.0Ag–0.5Cu solder alloy with an ultrasonic mixing technique. Composite solder pastes with 0.01–0.10 wt% nanotube reinforcement were prepared. The wettability, melting temperature, microstructure and mechanical properties of the composite solders were determined, and their dependency on nanotube loading assessed. Loading with 0.01 wt% Ag-coated SWCNTs improved the composite solder’s wetting properties, and the contact angle was reduced by 45.5 %, while over loading of the coated nanotubes up to 0.10 wt% degraded the wettability. DSC results showed only slight effects on the melting behavior of the composite solders. Cross-section microstructure analysis of the spreading specimens revealed uniform distribution of the intermetallic compounds throughout the solder matrix, and EDS analysis identified the phases as β-Sn, Ag$_{3}$Sn and Cu$_{6}$Sn$_{5}$. The mechanical properties of composite specimens, compared with those of unloaded 96.5Sn–3.0Ag–0.5Cu solder, had a maximal improvement in the shear strength of 11 % when the nanotube loading was 0.01 wt% of Ag-coated SWCNTs.
Starting Page	3707
Ending Page	3715
Page Count	9
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	24
Issue Number	10
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2013-05-31
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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