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Low-delectric Resin Composition and Copper-clad Laminate and Printed Circuit Board Using the Same Cross-reference to Related Applications
| Content Provider | Semantic Scholar |
|---|---|
| Author | Wang, Rongtao Chen, Kunshan Hsieh, Yu Sheng Tao-Yuanhsien, Tw Tian, Wenjun |
| Copyright Year | 2017 |
| Abstract | The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide: (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high fre quency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/0b/c3/29/e3b7e20b762883/US9402310.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |