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Copper foil for printed circuit board and copper-clad laminate for printed circuit board
Content Provider | Semantic Scholar |
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Author | 모리야마, 데루마사 이시이, 마사후미 |
Copyright Year | 2011 |
Abstract | On the surface of the copper foil, a nickel, zinc and copper foil for printed circuit board comprising a layer (hereinafter referred to as "copper-nickel-zinc layer") containing the copper, the zinc adhesion weight per unit area of the copper-nickel-zinc layer 200 ㎍ / dm 50% by weight, (zinc coating weight (% by mass)) / {100- (copper coating weight (% by weight))} is 0.3 or more, (copper coating weight (% by mass)) / {100- (a zinc coating weight (% by weight))} the printed circuit board, characterized in that at least 0.3 for the copper foil. Laminating the copper foil to the resin base material, and the sulfuric acid - in the case of the circuit soft etching using a hydrogen peroxide-based etching solution, to establish a surface treatment technique of the copper foil circuit which can effectively prevent erosion by task. |
File Format | PDF HTM / HTML |
Alternate Webpage(s) | https://patentimages.storage.googleapis.com/26/60/a8/2b3f05edbf2b51/US20100261033A1.pdf |
Language | English |
Access Restriction | Open |
Content Type | Text |
Resource Type | Article |