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Nsulating Resin Composition for Printed Circuit Board and Products Manufactured by Using the Same
| Content Provider | Semantic Scholar |
|---|---|
| Author | Yoo, Seong Hyun Lee, Hyun Jun Kim, Jin Young |
| Copyright Year | 2017 |
| Abstract | Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, Such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/88/09/2d/e793d7a9f9311b/US20150114693A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |