Loading...
Please wait, while we are loading the content...
Similar Documents
Resin Composition for Flexble Printed Circuit Board Cross-reference to Related Applications
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluo roresin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/59/07/f8/0bd03c6923ee86/US20130316170A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |