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Thereof and Ansotropic Conductive Adhesive Filmusing the Same Cross-reference to Related Applications
| Content Provider | Semantic Scholar |
|---|---|
| Author | Lee, Hyunjung |
| Copyright Year | 2017 |
| Abstract | The present invention relates to a microcapsule-conductive particle complex comprising a conductive particle consisting of conductive metallic particle or polymer particle coated on a Surface with a conductive metallic layer, a microcapsule being adsorbed by the conductive particle or adsorbing the conductive particle, comprising a core and a shell, wherein the core contains organic compound which is a curing agent for a fast curing at a low temperature and the shell has a surface functional group with affinity for metal of the con ductive metallic layer on its surface, a preparation method thereof and an anisotropic conductive film (ACF) using the |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/76/13/d9/08c071f709c25b/US20080131685A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
