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Substrate Assembly Containing Conductive Filmand Fabrication Method Thereof Cross Reference to Related Applications
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | (73) Assignee: R.E.S.OGY A substrate assembly containing a conductive film and a Hsinchu (TW) s fabrication method thereof are provided. The substrate S1C assembly includes a polymer Substrate, a Surface treatment layer formed on the polymer substrate and a conductive film 21) Appl. No.: 13/221,414 (21) Appl. No 9 formed on the surface treatment layer, wherein the conductive (22) Filed: Aug. 30, 2011 film is formed by sintering a metal conductive ink and the 9 Surface treatment layer is formed from a composite material (30) Foreign Application Priority Data of an auxiliary filler and a polymer. The auxiliary filler in the Surface treatment layer can deliver energy into the metal Dec. 30, 2010 (TW) ................................... 99146826 conductive ink for sintering the conductive metal ink. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/92/0c/ad/3bc0b644d8bac1/US20120168211A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |