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Method and System for Chemical Mechancal Polishing of Semconductor Wafer Technical Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Brady, Wade James |
| Copyright Year | 2017 |
| Abstract | 54) METHOD AND SYSTEM FOR CHEMICAL 5,181,985 l/1993 Lampert et al. ........................ 156,635 MECHANICAL POLISHING OF 5,294,570 3/1994 Fleming, Jr. et al. .................. 34/3 X SEMCONDUCTOR WAFER 5,320,706 6/1994 Blackwell ............ ... 156/636.1 5,329,732 7/1994 Karlsrud et al......................... 451?289 o 5,382.296 l/1995 Anttila ........................................ 134/3 I75) Inventor: Eugene O. Hempel, Garland, Tex. 5,389,194 2/1995 Rostoker et al. ........................ 134/13 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/86/98/54/8942828c2752f0/US5597443.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |