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Thermoplastic Chemical Mechanical Polishing Pad and Method of Manufacture Technical Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermo plastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %. The closed-cell thermoplastic foam polishing body also com prises filler particles comprising an average size ranging from about 1 to about 20 microns. Other aspects of the invention comprise a method for manufacturing the above described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/02/7a/d9/b35e2952f329b3/US20060154579A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |