NDLI: A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators

Content Provider	Scilit
Author	Wang, Z. X. Wang, H. Zhang, Y. Blaabjerg, F.
Copyright Year	2018
Description	Journal: Microelectronics Reliability
Related Links	https://vbn.aau.dk/ws/files/310751246/ESREF20180531_2.0.pdf
Ending Page	523
Page Count	5
Starting Page	519
ISSN	00262714
DOI	10.1016/j.microrel.2018.06.031
Journal	Microelectronics Reliability
Volume Number	88-90
Language	English
Publisher	Elsevier BV
Publisher Date	2018-09-30
Access Restriction	Open
Subject Keyword	Journal: Microelectronics Reliability Multi-chip Power Module
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Surfaces, Coatings and Films Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Condensed Matter Physics Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators