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Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Content Provider | Scilit |
---|---|
Author | Tang, Hongyu Ye, Huaiyu Wong, Cell K. Y. Leung, Stanely Y. Y. Fan, Jiajie Chen, Xianping Fan, Xuejun Zhang, Guoqi |
Copyright Year | 2017 |
Description | Journal: Microelectronics Reliability |
Related Links | https://repository.tudelft.nl/islandora/object/uuid:1fd964eb-af3f-4635-a8d9-5b48cd523767/datastream/OBJ/download |
Ending Page | 204 |
Page Count | 8 |
Starting Page | 197 |
ISSN | 00262714 |
DOI | 10.1016/j.microrel.2017.09.008 |
Journal | Microelectronics Reliability |
Volume Number | 78 |
Language | English |
Publisher | Elsevier BV |
Publisher Date | 2017-11-01 |
Access Restriction | Open |
Subject Keyword | Journal: Microelectronics Reliability Industrial Relations |
Content Type | Text |
Resource Type | Article |
Subject | Nanoscience and Nanotechnology Surfaces, Coatings and Films Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Condensed Matter Physics Safety, Risk, Reliability and Quality Electrical and Electronic Engineering |