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Mission-profile-based stress analysis of bond-wires in SiC power modules
Content Provider | Scilit |
---|---|
Author | Bahman, A. S. Iannuzzo, F. Blaabjerg, F. |
Copyright Year | 2016 |
Description | Journal: Microelectronics Reliability |
Related Links | https://vbn.aau.dk/ws/files/241106532/1_s2.0_S0026271416302463_main.pdf https://core.ac.uk/download/pdf/60663264.pdf |
Ending Page | 424 |
Page Count | 6 |
Starting Page | 419 |
ISSN | 00262714 |
DOI | 10.1016/j.microrel.2016.07.102 |
Journal | Microelectronics Reliability |
Volume Number | 64 |
Language | English |
Publisher | Elsevier BV |
Publisher Date | 2016-09-01 |
Access Restriction | Open |
Subject Keyword | Journal: Microelectronics Reliability |
Content Type | Text |
Resource Type | Article |
Subject | Nanoscience and Nanotechnology Surfaces, Coatings and Films Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Condensed Matter Physics Safety, Risk, Reliability and Quality Electrical and Electronic Engineering |