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Using infrared thermal responses for PCBA production tests: Feasibility study
Content Provider | Scilit |
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Author | Alaoui, Nabil El Belghiti Cassou, Anaïs Tounsi, Patrick Boyer, Alexandre Viard, Arnaud |
Copyright Year | 2019 |
Description | Journal: Microelectronics Reliability |
Related Links | https://hal.laas.fr/hal-02319468/file/ESREF2019_Final_Version_Paper_3.pdf |
ISSN | 00262714 |
DOI | 10.1016/j.microrel.2019.06.046 |
Journal | Microelectronics Reliability |
Volume Number | 100-101 |
Language | English |
Publisher | Elsevier BV |
Publisher Date | 2019-09-01 |
Access Restriction | Open |
Subject Keyword | Journal: Microelectronics Reliability Characterization and Testing of Materials Thermal Signatures Contactless Testing Principal Component Analysis |
Content Type | Text |
Resource Type | Article |
Subject | Nanoscience and Nanotechnology Surfaces, Coatings and Films Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Condensed Matter Physics Safety, Risk, Reliability and Quality Electrical and Electronic Engineering |