NDLI: Effects of crystal orientation and temperature on the deformation mechanism and mechanical property of Cu nanowire

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Effects of crystal orientation and temperature on the deformation mechanism and mechanical property of Cu nanowire

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Effects of crystal orientation and temperature on the deformation mechanism and mechanical property of Cu nanowire

Content Provider	IET Digital Library
Author	Pang, Weiwei Yu, Siyuan Lin, Zhijie Zhao, Yizhe Yin, Fuxing
Abstract	The effects of crystallographic direction and temperature on the deformation mechanism and properties of Cu nanowire (NW) are studied via systematic simulations and theoretical analysis. It is found that the elastic module, yield stress and yield strain are quite different for five oriented NWs. As the crystallographic orientation of NW varies, both the yield stress and the yield strain firstly reduce to the minimum value, then gradually increase. Furthermore, the evolutions of flow stress after yield point are also obviously different for five oriented NWs, which are associated with the plastic deformation mechanisms. With the crystallographic orientation of NW varying, the simulated atomic snapshots show that the dominant deformation mechanism transforms from the shuffling-assisted single dislocation-nucleation to the collective dislocation-nucleation, then to the twinning migration, and finally to the combination of dislocation glide and micro-twinning. According to the normal stress perpendicular to the slip plane and shear stress on the slip plane, the authors theoretically predict the deformation mechanisms for different oriented NWs, which turn to be in good consistent with the authors’ observed deformation mechanisms. Besides, they also propose that the temperature effects are different for different oriented NWs.
Starting Page	261
Ending Page	265
Page Count	5
Volume Number	15
e-ISSN	17500443
Issue Number	Issue 4, Apr (2020)
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/mnl/15/4
Alternate Webpage(s)	https://digital-library.theiet.org/content/journals/10.1049/mnl.2019.0559
Journal	Micro & Nano Letters
Publisher Date	2020-04-01
Access Restriction	Open
Rights Holder	© The Institution of Engineering and Technology
Subject Keyword	Copper Crystal Orientation Crystallographic Direction Crystallographic Orientation Cu Nanowire Deformation Deformation And Plasticity Dislocation Glide Dislocation Nucleation Elastic Constants Elastic Moduli Elasticity Elasticity And Anelasticity Flow Stress Grain And Twin Boundaries Mechanical Property Microtwinning Nanomechanics NanoParticle Nanotube And Nanostructured Material Nanowires Normal Stress Plastic Deformation Plastic Flow Plasticity And Creep Shear Stress Shuffling-assisted Single Dislocation-nucleation Simulated Atomic Snapshots Slip Slip, Creep, Internal Friction And Other Indirect Evidence of Dislocations Structure of Solid Clusters Temperature Effect Twinning Twinning Migration Yield Point Yield Strain Yield Stress
Content Type	Text
Resource Type	Article

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