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| Content Provider | IET Digital Library |
|---|---|
| Author | Nguyen, T. A. Joubert, P. Y. Lefebvre, S. Bontemps, S. |
| Abstract | The relevance of the eddy current sensing technique to monitor the ageing state of electronic power modules has been experimentally studied. To do so, a commercial eddy current sensor was implemented for the evaluation of COOLMOSTM transistor chips soldered on a direct copper bonded ceramic substrate of a power module. The measurement data obtained over a large frequency bandwidth were analysed in the normalised complex impedance plane. The analysis shows that the sensor enables the chip and the substrate to be separately sensed. Furthermore, the ageing state of artificially aged chips can be clearly monitored. These preliminary results allow the design of eddy current micro-sensors dedicated to power module in-service monitoring purposes to be envisaged. |
| Starting Page | 415 |
| Ending Page | 417 |
| Page Count | 3 |
| ISSN | 00135194 |
| Volume Number | 49 |
| e-ISSN | 1350911X |
| Issue Number | Issue 6, Mar (2013) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/49/6 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2012.4387 |
| Journal | Electronics Letters |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Ageing Ageing Chip Monitoring Artificially Aged Chips COOLMOS Transistor Chips Direct Copper Bonded Ceramic Substrate Eddy Current Microsensor Design Eddy Current Sensing Technique Eddy Current Sensor Eddy Currents Electric Sensing Device Electronic Power Module Frequency Bandwidth Analysis MEMS And NEMS Device Technology Microsensor Microsensors And Nanosensors Normalised Complex Impedance Plane Power Module In-service Monitoring Power Semiconductor Device Power Transistors Semiconductor Power Module |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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