NDLI: Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

Content Provider	IEEE Xplore Digital Library
Author	Zoschke, K. Wolf, M.J. Topper, M. Ehrmann, O. Fritzsch, T. Kaletta, K. Schmuckle, F.-J. Reichl, H.
Copyright Year	1999
Abstract	Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of integrated passive components. In this context, particularly the fabrication of integrated passive devices (IPDs) represents a promising solution regarding the reduction of size and assembly costs of electronic systems in package (SiP). IPDs combine different passive components (R,L ,C ) in one subcomponent to be assembled in one step by standard technologies like surface mount device (SMD) or flip chip. In this paper, the wafer level thin film fabrication of integrated passive devices (WL-IPDs) will be discussed. After a brief overview of the different possibilities for the realization of IPDs using wafer level packaging technologies two fabricated WL-IPDs will be presented. Design, technological realization, as well as results from the electrical characterization will be discussed.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	359
Ending Page	368
Page Count	10
File Size	2285632
File Format	PDF
ISSN	15213323
Volume Number	30
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Wafer scale integration Electronics packaging Integrated circuit packaging Integrated circuit technology Costs Surface-mount technology Thin film devices Assembly systems Flip chip wafer level packaging Advanced packaging embedded passives integrated passive devices integrated passives radio-frequency (RF)-components system-in-package (SiP)
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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