NDLI: The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

Content Provider	IEEE Xplore Digital Library
Author	Samadiani, E. Joshi, Y. Mistree, F.
Copyright Year	2007
Description	Author affiliation: G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA (Samadiani, E.; Joshi, Y.; Mistree, F.)
Abstract	In the near future, electronic cabinets of data centers will house high performance chips with heat fluxes approaching 100 W/cm and associated high volumetric heat generation rates. With the power trends in the electronic cabinets indicating 60 kW cabinets in the near future, the current cooling systems of data centers will be insufficient and new solutions will need to be explored. Accordingly, the key issue that merits investigation is identifying and satisfying the needed specifications of the new thermal solutions, considering the design environment of the next generation data centers. Anchoring our work in the open engineering systems paradigm, the authors identify the requirements of the future thermal solutions and explore various design specifications of an ideally open thermal solution for a next generation data center. To approach an open cooling system for the future data centers, the concept of a thermal solution centered on the multi-scale (multilevel) nature of the data centers is discussed. The potential of this solution to be open, along with its theoretical advantages compared with the typical air cooling solutions is demonstrated through some scenarios. The realization problems and the future research needs are highlighted to achieve a practical open multi-scale thermal solution in data centers. Such solution is believed to be the most effective and efficient for the next generation data centers
Starting Page	93
Ending Page	102
File Size	674460
Page Count	10
File Format	PDF
ISBN	1424408962
DOI	10.1109/THETA.2007.363416
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-01-03
Publisher Place	Egypt
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Design engineering Electronics cooling Heat engines Thermal engineering Thermal management Data engineering Systems engineering and theory Electronic mail Mechanical engineering Design optimization
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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