NDLI: Design, fabrication, and integration of piezoelectric MEMS devices for applications in wireless sensor network

Content Provider	IEEE Xplore Digital Library
Author	Jian Lu Yi Zhang Itoh, T. Maeda, R.
Copyright Year	2011
Description	Author affiliation: Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST), Namiki 1-2-1, Tsukuba, Ibaraki, 305-8564, Japan (Jian Lu; Yi Zhang; Itoh, T.; Maeda, R.)
Abstract	One of the competitive solutions to expand the function of microelectromechanical system (MEMS) is the integration of piezoelectric lead zirconate titanate (PZT) thin films for device self-actuation at low driving voltage, device self-sensing with low power consumption, as well as for energy harvesting. However, up-to-date, difficulties still exist not only in PZT film preparation but also in PZT film integration with other MEMS components and ICs. This paper therefore presents our recent progress on large area deposition, fine pattern etching, and low temperature bonding of PZT thin films for wafer scale PZT film integration and piezoelectric MEMS application. The energy dissipation mechanism in piezoelectric MEMS devices was also discussed to optimize the device structure for the pursuit of better performance. Ultra-sensitive micro cantilever and disk resonator with on-chip piezoelectric PZT transducers were presented herein as an exploratory application of piezoelectric MEMS devices in distributed wireless sensor network.
Starting Page	217
Ending Page	221
File Size	2383344
Page Count	5
File Format	PDF
ISBN	9781612849058
e-ISBN	9782355000157
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-05-11
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	CMP
Subject Keyword	Micromechanical devices Fabrication Films Q factor Energy dissipation Silicon Piezoelectric devices
Content Type	Text
Resource Type	Article

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