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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Smirnova, L. Pyrhonen, J. Ke Ma Blaabjerg, F. |
| Copyright Year | 2014 |
| Description | Author affiliation: Lappeenranta Univ. of Technol., Lappeenranta, Finland (Smirnova, L.; Pyrhonen, J.) || Aalborg Univ., Aalborg, Denmark (Ke Ma; Blaabjerg, F.) |
| Abstract | Modular Multilevel Converter (MMC) is a topology where series connection of Sub-Modules (SM) is used to achieve almost sinusoidal output voltage. The MMC converter with a large number of SMs is actively used in high voltage DC (HVDC) transmission systems where a bulky converter is not a difficult issue. In this paper the possibility to use a MMC with just a few SMs for wind power application with limited space in the nacelle is analysed. The current loading, electrical losses and thermal performance of the power devices in the converter solutions studied are analysed. It is shown that an MMC converter with full-bridge (FB) SMs has a more uniform loss and temperature distribution among the semiconductor devices than an MMC with half-bridge (HB) SMs. The reliability of the MMC converters is also investigated in terms of thermal loading. |
| Starting Page | 1 |
| Ending Page | 10 |
| File Size | 640827 |
| Page Count | 10 |
| File Format | |
| ISBN | 9781479930159 |
| DOI | 10.1109/EPE.2014.6910860 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-26 |
| Publisher Place | Finland |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Insulated gate bipolar transistors Thermal stress Multilevel converters Wind energy Loading Modulation Wind power generation Current distribution Power conversion Reliability |
| Content Type | Text |
| Resource Type | Article |
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