NDLI: Microcontact printing using flexible flat PDMS stamps with metal embedment

Content Provider	IEEE Xplore Digital Library
Author	Ikjoo Byun Jongho Park Beomjoon Kim
Copyright Year	2012
Description	Author affiliation: JST ERATO Higashiyama Live-Holonics Project, Nagoya Univ., Nagoya, Japan (Jongho Park) \|\| CIRMM, Univ. of Tokyo, Tokyo, Japan (Ikjoo Byun; Beomjoon Kim)
Abstract	This paper reports a microcontact printing (μCP) using flexible flat polydimethylsiloxane (PDMS) stamps with metal embedment. In conventional μCP process, self-assembled monolayer (SAM) ink can be transferred by conformal contact between a structural PDMS stamp and a substrate. In our research we utilized that hexadecanethiol (HDT), one of SAM ink molecules for μCP, can be soaked to the PDMS, but not to the Cr layer. Based on this fact, the PDMS with Cr embedment was used as a stamp for μCP even though there is `no structural tip' (i.e. flat) in PDMS stamps. The new stamps for μCP have no mechanical deformation of stamps' tip which is crucial problem of conventional PDMS stamps during μCP. Moreover, there are several advantages compared to other flat PDMS stamps, such as no limitation of lifetime and no contamination problem during fabrication process.
Sponsorship	IEEE
Starting Page	30
Ending Page	33
File Size	1068914
Page Count	4
File Format	PDF
ISBN	9781467328715
e-ISBN	9781467328715
DOI	10.1109/NMDC.2012.6527585
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-10-16
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface modification Self-assembled monolayer (SAM) Microcontact printing (μCP) Dry lift-off process
Content Type	Text
Resource Type	Article

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