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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kyung-Eun Byun Seongjun Park Heejun Yang Hyun-Jong Chung Hyun Jae Song Jaeho Lee Seo, D.H. Jinseong Heo Dongwook Lee Hyeon Jin Shin Yun Sung Woo |
| Copyright Year | 2012 |
| Description | Author affiliation: Samsung Adv. Inst. of Technol., Yongin, South Korea (Kyung-Eun Byun; Seongjun Park; Heejun Yang; Hyun-Jong Chung; Hyun Jae Song; Jaeho Lee; Seo, D.H.; Jinseong Heo; Dongwook Lee; Hyeon Jin Shin; Yun Sung Woo) |
| Abstract | One of the key components of modern device structures is the metal-semiconductor (MS) contact with low symmetric contact resistance. We report on a MS contact structure utilizing graphene insertion. In this strategy, graphene reduces or even eliminates in ideal conditions, the Fermi-level pinning at a MS junction. Since the metal, Ni, deposited on graphene reduced the work function of graphene, the doped graphene was able to lower the Schottky barrier at the MS junction. The Schottky barrier height of metal-graphene-Si (MGS) junction was obtained from temperature dependent I-V characteristics. We confirmed that the graphene doped with Ni reduced the Schottky barrier height from 0.67 eV to 0.20 eV in wafer scale test. We also demonstrated the formation of an ideal MGS Ohmic contact via conductive atomic force microscopy. The contact resistance of the ideal MGS was less than $1.0×10^{-6}$ Ω $cm^{2}$ with low doped Si $(10^{15}$ $cm^{3}).$ The resistance is comparable to that of a current device contact with highly doped Si. Since it only requires the insertion of a single layer of graphene, this method can be directly applied to the current Si technology to reduce the contact resistance at MS junctions. |
| Sponsorship | IEEE |
| Starting Page | 63 |
| Ending Page | 66 |
| File Size | 419071 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467328715 |
| e-ISBN | 9781467328715 |
| DOI | 10.1109/NMDC.2012.6527583 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-16 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Content Type | Text |
| Resource Type | Article |
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