NDLI: Chemically enhanced carbon nanotubes based thermal interface materials

Content Provider	IEEE Xplore Digital Library
Author	Daon, J. Sun, S. Jiang, D. Leveugle, E. Galindo, C. Jus, S. Ziaei, A. Ye, L. Fu, Y. Liu, J. Bai, J.
Copyright Year	2015
Description	Author affiliation: MC2 Bionanosystems Lab., Chalmers Univ. of Technol., Goteborg, Sweden (Sun, S.; Jiang, D.; Fu, Y.; Liu, J.) \|\| Ecole Centrale Paris, Châtenay-Malabry, France (Bai, J.) \|\| SHT Smart High Tech AB, Goteborg, Sweden (Ye, L.) \|\| Thales Res. & Technol., Palaiseau, France (Daon, J.; Leveugle, E.; Jus, S.; Ziaei, A.)
Abstract	With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned Carbon Nanotubes (VACNTs) can be used to play this role. Indeed, carbon nanotubes are among the best thermal conductors (~3.000 W/mK) and in the form of VACNT mats, show interesting mechanical properties. On one side, VACNTs are in contact with their growth substrate and there is a low thermal resistance. On the other side, good contact must be created between the opposite substrate and the VACNTs in order to decrease the contact thermal resistance. A thin-film deposition of an amorphous material can be used to play this role. This paper reports a chemically enhanced carbon nanotube based TIM with creation of chemical bonds between the polymer and VACNTs. We show that these covalent bonds enhance the thermal transfer from VACNTs to a copper substrate and can dramatically decrease local resistances. Implementation processes and thermal characterizations of TIMs are studied and reported.
Sponsorship	IEEE
Starting Page	1
Ending Page	4
File Size	634340
Page Count	4
File Format	PDF
ISBN	9781467397056
DOI	10.1109/THERMINIC.2015.7389610
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-30
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Degradation Thermal resistance Carbon nanotubes Thermal conductivity Polymers Substrates
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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