NDLI: Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Content Provider	IEEE Xplore Digital Library
Author	Daon, J. Sun, S. Jiang, D. Cibien, G. Leveugle, E. Galindo, C. Ziaei, A. Ye, L. Fu, Y. Bai, J. Liu, J.
Copyright Year	2014
Description	Author affiliation: Lab. MSSMAT, Ecole Centrale Paris, Châtenay-Malabry, France (Bai, J.) \|\| MC2 Bionanosystems Lab., Chalmers Univ. of Technol., Goteborg, Sweden (Sun, S.; Jiang, D.; Liu, J.) \|\| SHT Smart High Tech AB, Goteborg, Sweden (Ye, L.; Fu, Y.) \|\| Thales Res. & Technol., Palaiseau, France (Daon, J.; Cibien, G.; Leveugle, E.; Galindo, C.; Ziaei, A.)
Abstract	In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with $Al_{2}O_{3}$ diffusion barrier layer using Thermal CVD process. In many cases, “die attach” thermal interface materials need to be electrically conductive and the growth of dense VA-CNT mats on an electrically conductive substrate remains a challenge. This paper presents the growth of dense VA-CNT mats on doped silicon with $Al_{2}O_{3}$ and TiN diffusion barrier layer. Processes, thermal and electrical characterization of VA-CNTs based thermal interface materials are studied and reported.
Starting Page	1
Ending Page	4
File Size	2097207
Page Count	4
File Format	PDF
ISBN	9781479954155
DOI	10.1109/THERMINIC.2014.6972534
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-09-24
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Thermal conductivity Silicon Substrates Aluminum oxide
Content Type	Text
Resource Type	Article

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