NDLI: Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics

Content Provider	IEEE Xplore Digital Library
Author	Rajaguru, P. Lu, H. Bailey, C. Ortiz-Gonzalez, J. Alatise, O.
Copyright Year	2015
Description	Author affiliation: Sch. of Eng., Univ. of Warwick, Coventry, UK (Ortiz-Gonzalez, J.; Alatise, O.) \|\| Comput. Mech. Reliability Group, Univ. of Greenwich, London, UK (Rajaguru, P.; Lu, H.; Bailey, C.)
Abstract	This paper details a finite element modelling approach of the press pack assembly process for a diode in a power electronic module. Molybdenum and aluminum graphite have been investigated as suitable materials for the contact pad. Contact analysis has been used to model the pressurized thermal interface in order to extract both the stress and temperature distribution in the diode. Average temperature and von Mises stress on the chip for a combination of clamping pressure, load current and contact pad material have been extracted from the modeling results. At present, based on the assumptions and modeling parameters used, Aluminum Graphite seems to have better performance in comparison with molybdenum in terms of generating a lower average chip temperature. Additionally optimum clamping pressure has been estimated by performing a numerical optimisation analysis in order to minimise both the average temperature and stress in the chip.
Sponsorship	IEEE
Starting Page	1
Ending Page	6
File Size	863299
Page Count	6
File Format	PDF
ISBN	9781467397056
DOI	10.1109/THERMINIC.2015.7389607
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-30
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Presses Contacts Thermal resistance Finite element analysis Clamps Stress Load modeling
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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