NDLI: Stress impact of thermal-mechanical loads measured with the stress chip

Content Provider	IEEE Xplore Digital Library
Author	Schindler-Saefkow, F. Rost, F. Otto, A. Keller, J. Winkler, T. Wunderle, B. Michel, B. Rzepka, S.
Copyright Year	2013
Description	Author affiliation: Micro Mater. Center, Fraunhofer ENAS, Chemnitz, Germany (Schindler-Saefkow, F.; Rost, F.; Otto, A.; Wunderle, B.; Michel, B.; Rzepka, S.) \|\| AMIC Angewandte Micro-Messtech. GmbH, Berlin, Germany (Keller, J.) \|\| Berliner Nanotest & Design GmbH, Berlin, Germany (Winkler, T.)
Abstract	The experimental observation of the actual thermo mechanical weak points in microelectronics packages remains a big challenge. Recently, a stress sensing system has been developed by a publicly funded project that allows measuring the magnitudes and the distribution of the stresses induced in the silicon dies by thermo-mechanical loads. Some application experiments will be presented, e.g. thermal loads, 4-point bending on CoB setups, and moisture swelling. The stress chip was detecting CTE mismatch, transition temperature, delamination, creep relaxations and volume swelling of moisture loads. All measurements are supplemented by finite element simulations based on calibrated models for in-depth analysis and for extrapolating the stress results to sites of the package that cannot measured directly. The methodology of closely combining stress measurements at inner points and FE simulation presented in this paper has been able to validate the stress sensing system for tasks of comprehensive design and process characterization as well as for health monitoring. It allows achieving both, a substantial reduction in time to- market and a high level of reliability under service conditions, as needed for future electronics and smart systems packages.
Starting Page	110
Ending Page	115
File Size	3629602
Page Count	6
File Format	PDF
ISBN	9781479922710
e-ISBN	9781479922727
DOI	10.1109/THERMINIC.2013.6675235
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-09-25
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text
Resource Type	Article

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