NDLI: Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design

Content Provider	IEEE Xplore Digital Library
Author	Ningkang Li Schlottig, G. De-Fazio, M. Sharma, C.S. Tiwari, M. Brioschi, R. Poulikakos, D. Brunschwiler, T.
Copyright Year	2013
Description	Author affiliation: ETH Zurich, Zurich, Switzerland (Sharma, C.S.; Tiwari, M.; Poulikakos, D.) \|\| STMicroelectron., Agrate, Italy (De-Fazio, M.; Brioschi, R.) \|\| IBM Res. - Zurich, Zurich, Switzerland (Ningkang Li; Schlottig, G.; Brunschwiler, T.)
Abstract	In this paper, we propose a novel lid-integrated cold plate with distributed fluid delivery architecture to a silicon microchannel heat exchanger. The microchannels consist of a staggered fin array. The manifold topology tolerates the use of a one-component lid, compatible with high volume fabrication processes, such as injection molding. A multi-scale modelling methodology based on the porous media approximation is introduced and compared with experimental results. The fluid cavity of the heat exchanger in the full heat sink model is represented as a two-dimensional porous domain. This approximation reduces the computational cost to solve the conjugate heat and mass transfer problem significantly. The characteristic of the cold plate is discussed based onfull heat sink model results. The main pressure drop of 93%for the base-line case can be attributed to the losses in the staggered fin array. The flow non-uniformity in the heat exchanger is less than 1.2% A sensitivity analysis with the objective o.f reducing the pumping power for a nominal thermal performance was performed based on a lumped model. it is preferable to increase the number of sub-sections and to reduce the fin dimension in the heat exchanger. The increase in access slit width is of moderate importance. The optimal case computed has 100 pm wide microchannelfins, accessed by 8 manifold.fingers that have 400 pm wide slits at their bottom. This case requires 0.5 W pumping power for a thermal resistance of 12 $Kmm^{2}/W.$
Starting Page	224
Ending Page	230
File Size	1562276
Page Count	7
File Format	PDF
ISBN	9781479922710
e-ISBN	9781479922727
DOI	10.1109/THERMINIC.2013.6675202
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-09-25
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text
Resource Type	Article

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