NDLI: Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

Content Provider	IEEE Xplore Digital Library
Author	Gerty, D. Gerlach, D.W. Joshi, Y.K. Glezer, A.
Copyright Year	2007
Description	Author affiliation: Georgia Inst. of Technol., Atlanta (Gerty, D.; Gerlach, D.W.; Joshi, Y.K.; Glezer, A.)
Abstract	A design for cooling 3D stacked chip electronics is proposed using solid heat spreaders of high thermal conductivity interleaved between the chip layers. The spreaders conduct heat to the base of an advanced synthetic jet cooled heat sink. A prior computational study showed that for moderate power dissipations, 5 W in each 27times38 mm layer, a 250 mum thick copper heat spreader would conduct heat adequately. However, the mismatch in coefficient of thermal expansion between copper and silicon required large holes through the copper layer for electrical vias. The current study investigates the design of a thermal prototype for experimental testing. Each active layer will incorporate a thermal test die to simulate an FPGA and a smaller one to simulate a DRAM. The spreader layer will be silicon with no via holes. The heat sink will contact only three of the stack sides to allow wirebond connections on the fourth side. The effect of the power dissipated and the heat transfer coefficient applied to the peripheral surface are studied. In order to remove the heat from the edges of a multi-layer stack and transfer it to the ambient air, a novel active heat sink design has been implemented using a matrix of integrated synthetic jets. In previous synthetic jet heat sink designs, cooling air is entrained upstream of the heat sink and is driven along the length of the fins. In the new design, synthetic jets emanate from the base of the fins so that the induced jets and entrained (cooling) ambient air flow along the fin height. The velocity field of the active heat sink is mapped using particle image velocimetry (PIV). Thermal performance is characterized using a surrogate heater and embedded thermocouple sensors. The thermal performance of identical heat sinks cooled by the two synthetic jet approaches is compared. An improved third heat sink solution is introduced and compared to previous results
Starting Page	156
Ending Page	161
File Size	706510
Page Count	6
File Format	PDF
ISBN	9782355000027
DOI	10.1109/THERMINIC.2007.4451769
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-09-17
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	TIMA
Subject Keyword	Thermal management of electronics Prototypes Thermal management Solids Thermal conductivity Silicon Copper Heat sinks Heat transfer Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic Jets

Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders

DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS

DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS

Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics

Realization and thermal analysis of silicon thermal spreaders used in power electronics cooling

A novel conduction-convection based cooling solution for 3D stacked electronics

Thermal management with graphene lateral heat spreaders: A feasibility study

Effect of Synthetic Jets Over Natural Convection Heat Sinks

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

Similar Documents

A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic Jets

Parametric thermal modeling of 3D stacked chip electronics with interleaved solid heat spreaders

DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS

DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS

Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics

Realization and thermal analysis of silicon thermal spreaders used in power electronics cooling

A novel conduction-convection based cooling solution for 3D stacked electronics

Thermal management with graphene lateral heat spreaders: A feasibility study

Effect of Synthetic Jets Over Natural Convection Heat Sinks

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets