NDLI: Realization and thermal analysis of silicon thermal spreaders used in power electronics cooling

Content Provider	IEEE Xplore Digital Library
Author	Ivanova, M. Schaeffer, C. Avenas, Y. Lai, A. Gillot, C.
Copyright Year	2003
Description	Author affiliation: Lab. d'Electrotech. de Grenoble, ENSIEG, St. Martin d'Heres, France (Ivanova, M.; Schaeffer, C.; Avenas, Y.)
Abstract	Currently the thermal losses of power electronic devices are increasing. At the same time, their sizes are decreasing. Consequently heat sinks have to dissipate very large heat flux densities. Heat pipes are very effective heat transfer devices and can be used to raise the thermal conductive path in order to spread a concentrated heat source over a much larger surface area. As a result, the high heat flux at the heat source can be reduced to a much smaller and manageable level that can be dissipated through conventional cooling methods. At the first part of this paper we present the silicon heat spreader structure. Then an analytical model of heat pipe limits is described and finally an experimental study and test results are presented in order to show the interests of heat pipes in power electronics cooling.
Sponsorship	IEEE Industrial Electronics Soc. Univ. of Maribor
Starting Page	1124
Ending Page	1129
File Size	345184
Page Count	6
File Format	PDF
ISBN	0780378520
DOI	10.1109/ICIT.2003.1290821
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-12-10
Publisher Place	Slovenia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Electronics cooling Heat transfer Heat sinks Thermal conductivity Space heating Power electronics Water heating Electronic equipment testing Hydraulic diameter
Content Type	Text
Resource Type	Article

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