NDLI: Thermal challenges in 3-D stacked packaging

Please wait, while we are loading the content...

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

20th International Workshop on Thermal Investigations of ICs and Systems

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

18th International Workshop on THERMal INvestigation of ICs and Systems

2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2010 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2009 15th International Workshop on Thermal Investigations of ICs and Systems

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

13th International Workshop on THERMal INvestigation of ICs and systems

Abstracting / indexing

Workshop Committee

Table of contents

Thermal challenges in 3-D stacked packaging

Application of structure functions for the investigation of forced air cooling

Utility of transient testing to characterize thermal interface materials

Short time die attach characterization of semiconductor devices

Method of images for the fast calculation of temperature distributions in packaged VLSI chips

New reliability assessment method for solder joints in BGA package by considering the interaction between design factors

Evaluation technique for the failure life scatter of lead-free solder joints in electronic device

Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

The characteristics of electromigration and thermomigration in flip chip solder joints

Development of EHD ion-drag micropump for microscale electronics cooling

Numerically investigating the effects of cross links in scaled microchannel heat sinks

Copper-filled macroporous Si for microchannel heat sink tecnology

Dependency of heat transfer rate on the Brinkman number in microchannels

A novel VLSI technology to manufacture high-density thermoelectric cooling devices

Development of the micro capillary pumped loop for electronic cooling

Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages

Very fast chip-level thermal analysis

Investigation of micro porosity sintered wick in vapor chamber for fan less design

Study of water speed sensitivity in a multifunctional thick-film sensor by analytical thermal simulations and experiments

Advancement of Multifunctional support structure technologies (AMFSST)

Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading

Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Combination of thermal subsystems modeled by rapid circuit transformation

A novel thermal position sensor integrated on a plastic substrate

Influence of transparent surface layer on effective thermoreflectance coefficient of typical stacked electronic structures

Dynamic thermoelectric device SPICE model for transient cooling analysis

High-performance thermal interface technology overview

Thermal networks from phonon Boltzmann's transport equation: Part I - Fundamentals

Thermal networks from phonon Boltzmann's transport equation: Part II - Compact modeling

Flexible profile approach to the steady conjugate heat transfer problem

A new methodology for extraction of dynamic compact thermal models

Acoustically enhanced boiling heat transfer

Fully integrated one phase liquid cooling system for organic boards

Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets

Evaluation of cooling solutions for outdoor electronics

Investigation of thermal processes in high power laser bars by thermoreflectance spectroscopy

Joule expansion imaging techniques on microlectronic devices

Improvements of the variable thermal resistance

Micro-hotplates for thermal characterisation of structural materials of MEMS

A modular high temperature measurement set-up for semiconductor device characterization

Thermal management and thermal resistance of high power LEDs

Dynamic electrothermal simulation of integrated resistors at device level

Lumped and distributed parameter SPICE models of TE devices considering temperature dependent material properties

Optimal sensor configuring techniques for the compensation of thermo-elastic deformations in high-precision systems

Inverse damage detection in IC packaging component

Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers

Reducing average and peak temperatures of VLSI CMOS digital circuits by means of heuristic scheduling algorithm

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in