NDLI: The characteristics of electromigration and thermomigration in flip chip solder joints

Content Provider	IEEE Xplore Digital Library
Author	Dan Yang Chan, Y.C.
Copyright Year	2007
Description	Author affiliation: City Univ. of Hong Kong, Hong Kong (Dan Yang; Chan, Y.C.)
Abstract	Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder interconnections was highly related to the current density. During the electromigration process, Pb migration was apparently visible because of its faster diffusivity. Meanwhile, voids were initiated at the entry location of the electron flow due to the current crowding effect. Numerical simulation also predicted a local current density of above 105 $A/cm^{2}$ within the solder joint In the thermomigration process, the transport of Pb was detected owing to the thermal gradient across the solder joint. Voids also occurred at the contact window due to accelerated atomic diffusion. In addition, the effect of electromigration and thermomigration on the mechanical behavior of the solder joint was examined through shearing tests.
Starting Page	43
Ending Page	47
File Size	1956103
Page Count	5
File Format	PDF
ISBN	9782355000027
DOI	10.1109/THERMINIC.2007.4451744
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-09-17
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	TIMA
Subject Keyword	Electromigration Temperature distribution Flip chip solder joints Thermal resistance Proximity effect Numerical simulation Acceleration Soldering Current density Electrons
Content Type	Text
Resource Type	Article

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