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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Finch, C. Yang, X. Wu, T. Abbott, B. |
| Copyright Year | 2001 |
| Description | Author affiliation: Central Florida Univ., Orlando, FL, USA (Finch, C.) |
| Abstract | As SAW filters move to higher frequencies and smaller sizes, the packaging structure has an increasing effect on the electrical performance of the device. In order to correctly design a SAW filter, the package performance must be considered concurrently in the design process. This paper describes several new methods for package simulation in which a full-wave electromagnetic (EM) simulator is used to create a package model. A ceramic chip and wire package is used to demonstrate the techniques. The package model is combined with a model of a SAW ladder filter at 1960 MHz and compared to measured data. The full-wave simulation is first performed on an empty package, with inductors used to represent bond wires. More accuracy can be achieved if simplified bond wires are included in the full-wave analysis, although computation time increases. A more accurate model of the bond wire shape increases simulation time, with no increase in accuracy. Our results demonstrate that full-wave analysis techniques are useful for predicting critical parameters such as the shape and rejection level of a SAW filter. |
| Sponsorship | Ultrasonics, Ferroelectr., & Frequency Control Soc |
| Starting Page | 81 |
| Ending Page | 84 |
| File Size | 155620 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780371771 |
| DOI | 10.1109/ULTSYM.2001.991583 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2001-10-07 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Radio frequency SAW filters Packaging Bonding Wire Computational modeling Shape Process design Electromagnetic modeling Ceramics |
| Content Type | Text |
| Resource Type | Article |
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