NDLI: Influence of pre-annealing and Mn + Al double doping on the microstructure and thermoelectric properties of iron disilicide

Content Provider	IEEE Xplore Digital Library
Author	Chen, H.Y. Zhao, X.B. He, Z.M. Stiewe, C. Muller, E.
Copyright Year	2006
Description	Author affiliation: State Key Lab. of Silicon Mater., Zhejiang Univ., Hangzhou (Chen, H.Y.; Zhao, X.B.; He, Z.M.)
Abstract	Iron disilicide based thermoelectric materials with the designed composition $Fe_{1-x}Mn_{x}Al_{y}Si_{2-y}$ (x = 0.06, 0.08; y = 0, 0.02, 0.04) were prepared by rapid solidification and hot pressing (1193K, 100 MPa, 30 minutes). The effects of Mn+Al double doping were investigated. The influence of pre-annealing on the microstructure and the transport properties were also studied. X-ray diffraction and scanning electron microscopy show that after pre-annealing at 800degC for only 10 hours, the high temperature phases $(alpha-Fe_{2}Si_{5}$ and epsiv-FeSi) in the rapidly solidified powders $Fe_{1-x}Mn_{x$ $}Al_{y}Si_{2-y}$ have been completely transformed to $(beta-FeSi_{2}$ phase for y = 0 and y = 0.02. It is found that the grain growth during hot pressing was suppressed for the pre-annealed samples. For the pressed compacts, the Seebeck coefficient was markedly enhanced by the pre-annealing treatment, while both the electrical conductivity and the thermal conductivity were decreased. Mn+Al double doping improves the electrical conductivity, but deteriorates the Seebeck coefficient and the thermal conductivity. The maximum of the figure of merit (ZT = 0.20) is obtained at 890 K for the sample double doped with y = 0.04 $(Fe_{0.94}Mn_{0.06}Al_{0.02}Si_{1.98})$ that is hot pressed from pre-annealed powders
Starting Page	670
Ending Page	673
File Size	337421
Page Count	4
File Format	PDF
ISBN	1424408105
ISSN	10942734
DOI	10.1109/ICT.2006.331230
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-06
Publisher Place	Austria
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Doping Microstructure Thermoelectricity Iron Thermal conductivity Pressing Powders Composite materials X-ray diffraction Electrons
Content Type	Text
Resource Type	Article

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