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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Schilz, J. Helmers, L. Kang, Y.S. Noda, Y. Niino, M. |
| Copyright Year | 1997 |
| Description | Author affiliation: Inst. of Mater. Res., German Aerosp. Res. Establ., Koln, Germany (Schilz, J.) |
| Abstract | We report on the development of a stacked thermogenerator element consisting of Bi-Te based materials for the low temperature and FeSi/sub 2/ for the high temperature stage. In order to determine the optimum segment length, a new numerical method was applied which maximizes the differential, i.e. local electrical power output. The resulting segment length for the Bi-Te stage is smaller than predicted by locally maximizing the figure of merit. For the practical preparation of the anticipated structure, powdered semiconductors and metals were consolidated by means of a uniaxial hot-pressing method, i.e. So-called plasma activated sintering (PAS). It was also employed in directly forming the material junctions. Due to the large differences in thermophysical and mechanical properties, Bi-Te and FeSi/sub 2/ cannot be directly joined in a single processing step. We employed Ni as a suitable common interface material with intermediate coefficient of thermal expansion. The joint to the low yield strength FeSi/sub 2/ requires however an additional layer, for which NiFe alloys were identified to be applicable. From the standpoint of electrical and thermal transport, all junctions exhibit reliable properties. Problems occur at the FeSi/sub 2//NiFe interface under high atmospheric temperatures due to the development of corrosion products and mechanical mismatch of the reaction layer. |
| Starting Page | 375 |
| Ending Page | 378 |
| File Size | 550925 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780340574 |
| ISSN | 10942734 |
| DOI | 10.1109/ICT.1997.667156 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1997-08-26 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermoelectricity Plasma temperature Temperature sensors Aerospace materials Tellurium Plasma materials processing Corrosion Thermoelectric devices Temperature distribution Laboratories |
| Content Type | Text |
| Resource Type | Article |
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