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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sayre, E.P. |
| Copyright Year | 1996 |
| Description | Author affiliation: North East Syst. Associates Inc., USA (Sayre, E.P.) |
| Abstract | This paper is a unique documentation of a MCM thermal failure due to inadequate signal integrity of the test fixture used for at-speed testing. An accurate SPICE model of the rest fixture and MCM was developed utilizing TDR techniques and analytical representations of the test fixture elements. The SPICE analysis showed clearly that impedance mismatches within the fixture components and MCM carrier and test socket caused a significant increase in the RMS driver current and produced a 33% increase in power dissipation in each MCM I/O driver. The additional dissipation, in conjunction with the elevated temperature test environment caused the thermal failures observed during at-speed testing. |
| Starting Page | 834 |
| Ending Page | 838 |
| File Size | 433331 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780335414 |
| ISSN | 10893539 |
| DOI | 10.1109/TEST.1996.557144 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1996-10-20 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fixtures SPICE Temperature Failure analysis Sockets Production System testing Impedance Power dissipation Voltage |
| Content Type | Text |
| Resource Type | Article |
| Subject | Applied Mathematics Electrical and Electronic Engineering |
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