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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wu, S.H. Tetelbaum, A. Wang, L.-C. |
| Copyright Year | 2008 |
| Description | Author affiliation: LSI Corp., Milpitas, CA (Wu, S.H.; Tetelbaum, A.) |
| Abstract | As mainstream processing technology advances into 65 nm and beyond, many factors that were previously considered secondary or insignificant, can now have an impact on chip timing. One of these factor is inversed temperature dependence (ITD). As supply voltage continues scaling into sub-IV territory, delay-temperature relationship can be reversed on some cells, meaning that device switching time may decrease as temperature increases. ITD posts a new challenge for timing sign-off because the highest and lowest sign-off temperatures may no longer be the worst-case and best-case timing corners. This work discuss the effect of ITD and its implication on timing sign-off, based on a standard cell library used in a typical design flow. |
| Starting Page | 297 |
| Ending Page | 300 |
| File Size | 308628 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424418107 |
| DOI | 10.1109/ICICDT.2008.4567300 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-06-02 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature dependence Timing Temperature sensors Libraries Low voltage Large scale integration Delay effects Circuits Propagation delay Electron mobility |
| Content Type | Text |
| Resource Type | Article |
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