NDLI: Life time prediction for lead-free solder joints under vibration loads

Content Provider	IEEE Xplore Digital Library
Author	Meier, K. Roellig, M. Schiessl, A. Wolter, K.
Copyright Year	2011
Description	Author affiliation: Fraunhofer IZFP-D, Dresden, Germany (Roellig, M.) \|\| Continental Automotive GmbH, Regensburg, Germany (Schiessl, A.) \|\| Technische Universität Dresden, Electronics Packaging Laboratory, D-01062, Germany (Meier, K.; Wolter, K.)
Abstract	In this work the life time of solder joints of SMD components is studied under vibration loading. This kind of purely mechanical load is one of the main failure causes in automotive electronics. A test vehicle has been designed to enable vibration testing on SMD capacitors (size 0805). The test vehicle is distinguished with a line clamping and stripe shape which both leads to a concerted loading of the component solder joints. The test vehicles were analysed for their resonant frequency prior test and loaded with a sinusoidal vibration close to the resonant frequency for certain numbers of cycles. The loading of the individual components was measured using a vibrometer. Components were stressed with wave amplitudes from 0.3 mm up to 0.8 mm and normalised cycle counts from 1 up to 12. All tests were accomplished at room temperature. Cross sectioning was performed to evaluate damage location within and cracking of the solder joints. The observed damage location clearly differs to results from temperature cycling tests. Cracking of the intermetallic interface was not observed. Cracks propagated in the solder bulk. This enables a solder fatigue model since no interface effect is involved in the damage process.
File Size	2712203
File Format	PDF
ISBN	9781457701078
e-ISBN	9781457701061
DOI	10.1109/ESIME.2011.5765838
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-04-18
Publisher Place	Austria
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Frequency measurement Optical variables measurement Lead Position measurement Optical devices Vibration measurement Deformable models
Content Type	Text
Resource Type	Article

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