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Content Provider | IEEE Xplore Digital Library |
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Author | Horng, T.S. Jau, J.K. Tsai, Y.S. Huang, C.S. |
Copyright Year | 2005 |
Description | Author affiliation: Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan (Horng, T.S.; Jau, J.K.; Tsai, Y.S.; Huang, C.S.) |
Abstract | This paper presents a state-of-the-art technique for broadband modeling of on-chip passive components. The proposed decomposition and reconstruction methodology can efficiently and accurately establish the broadband SPICE model for an arbitrary multi-port reciprocal component over an extremely large bandwidth. The idea is to decompose a multi-port network into a number of one-port networks which can be lumped modeled simply and easily. Then a reconstruction process, based on the modified T-equivalent circuit topology, is invented to combine these one-port lumped models into a broadband multi-port model. In this modeling study, the S parameters for a series of passive components including spiral inductors, MIM capacitors, bifilar transformers and baluns, fabricated using a 0.18 /spl mu/m RF-CMOS foundry process, have been measured up to 20 GHz. The modeled S parameters agree quite satisfactorily with the measured results over the entire measurement frequency range. |
Sponsorship | IEEE Microwave Theory and Techniques Soc. IEEE Electron Devices Soc. IEEE Solid State Circuits Soc |
Starting Page | 299 |
Ending Page | 302 |
File Size | 722567 |
Page Count | 4 |
File Format | |
ISBN | 0780389832 |
ISSN | 15292517 |
DOI | 10.1109/RFIC.2005.1489790 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2005-06-12 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Circuit topology Scattering parameters Frequency measurement SPICE Bandwidth Spirals Inductors MIM capacitors Transformers Impedance matching |
Content Type | Text |
Resource Type | Article |
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