NDLI: Highly integrated, dual band/tri-mode SiGe BiCMOS transmitter IC for CDMA wireless applications

Content Provider	IEEE Xplore Digital Library
Author	Reddy, M. Yates, D. Chang-Hyeon Lee Taskov, G. Mudge, P. Robinson, T. Li, L. Agarwal, B. Sung-Sik Hwang
Copyright Year	2002
Description	Author affiliation: Conexant Syst. Inc., Newport Beach, CA, USA (Reddy, M.; Yates, D.; Chang-Hyeon Lee; Taskov, G.; Mudge, P.; Robinson, T.; Li, L.; Agarwal, B.; Sung-Sik Hwang)
Abstract	A highly integrated transmitter IC fabricated in Conexant's 0.35 um SiGe BiCMOS process and packaged in a 6 mm /spl times/ 6 mm Land Grid Array (LGA) package provides dual band/tri-mode transmitter functionality in a CDMA handset meeting TIA/EIA 98-D specifications. This chip upconverts the I/Q baseband signals to RF in two stages and delivers the amplified RF signal to the power amplifier. It consists of the following stages: an I/Q modulator, VHF VCO, VHF PLL, IF VGA, UHF LO buffer, UHF PLL, 3 wire serial interface, RF image reject upconverter, a cellular PA driver and dual PCS drivers. It is designed to deliver 8 dBm in CDMA mode in Cellular band, 11 dBm in AMPS mode and 9 dBm in CDMA mode in PCS band at 90 mA, 88 mA and 108 mA respectively at nominal supply and temperature. It also provides IF dynamic range of 80 dB in the IF VGA and RF Gain dynamic range of 20 dB in Cellular band and 15 dB in PCS band. The IC operates from a supply ranging from 2.7 V to 3.3 V and a temperature range of -30C to 85C.
Sponsorship	IEEE Microwave Theory and Techniques Soc. IEEE Electron Devices Soc. IEEE Solid States Circuits Soc
Starting Page	35
Ending Page	38
File Size	345123
Page Count	4
File Format	PDF
ISBN	0780372468
ISSN	15292517
DOI	10.1109/RFIC.2002.1011505
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-06-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	BiCMOS integrated circuits Dual band Silicon germanium Germanium silicon alloys Transmitters Multiaccess communication Radio frequency Personal communication networks Integrated circuit packaging Phase locked loops
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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