NDLI: Research on preparation and properties of PI-EP composite material

Content Provider	IEEE Xplore Digital Library
Author	Yufei Chen Wei Yue Zongzhen Bian Yong Fan Yating Chen
Copyright Year	2012
Description	Author affiliation: The College of Materials Science and Engineering, Harbin University of Science and Technology, 150040, CHINA (Yufei Chen; Wei Yue; Zongzhen Bian; Yong Fan; Yating Chen)
Abstract	A series of PI-EP composite materials under different imidization temperature gradients were prepared from 3,3′-diethyl-4,4′-diamino diphenyl methane (DEDA DPM), benzop-henone tetracarboxylic acid dianhydride (BTDA) and epoxy resin (E-51), and thermal imide process was used. Fourier transform infrared spectroscopy (FI-TR) indicated that the chemical reactions between poly(amic acid) and epoxy resin was existence and imide ring had formed. Heat-resistant property, dielectric property and mechanical property of PI-EP composite materials were tested, respectively. The results showed that the order of the materials heat resistance was 493 K>523 K>473 K> 453 K, dielectric constant and dielectric loss were ranged from 3.30∼3.68 and $1.2×10^{−3}∼1.3×10^{−2},$ the shear strength of PI-EP-493 K was the best and attained maximum value 8.962 MPa, the adhesive forces of all composite materials were at the higher level (one or two level), fully met the applied requirement.
Starting Page	1
Ending Page	4
File Size	584800
Page Count	4
File Format	PDF
ISBN	9781467328524
ISSN	21609241
e-ISBN	9781467328517
DOI	10.1109/ICPADM.2012.6319003
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-07-24
Publisher Place	India
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Materials Heating synthesis polyimide epoxy resin
Content Type	Text
Resource Type	Article

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